About Mixx Technologies
Mixx Technologies is building next-generation optical interconnect solutions that enable true system-level integration for hyperscale data centers. We combine expertise in silicon photonics, packaging, fiber connectivity and system integration to deliver products that set new standards for performance, density, and scalability to drive the next generation of artificial intelligence.

Position Overview
We are seeking a visionary Advanced Packaging Lead Architect to define the mechanical and structural roadmap for our next-generation optical interconnects. In this high-impact leadership role, you will spearhead the architectural definition of 2.5D, 3D, and 3.5D packaging solutions.
You will be responsible for the high-level technical strategy, balancing complex trade-offs between thermal-mechanical stability, signal integrity, and manufacturability. You will lead cross-functional efforts to ensure our heterogeneous integration structures drive the future of AI
infrastructure.

Key Responsibilities
• Define the architectural strategy for advanced multi-die systems, including
silicon/organic interposers, TSVs, and micro-bump configurations.
• Lead thermal-mechanical co-design efforts, establishing the framework for warpage mitigation and CTE mismatch management across complex material interfaces.
• Drive Design of Experiments (DOE) and tolerance analysis at the system level to ensure robust performance under extreme manufacturing and thermal cycling conditions.
• Oversee advanced FEA methodologies, ensuring that simulation models for thermal stress and mechanical strain are validated against experimental reliability data.
• Collaborate with executive leadership and cross-functional teams (optical, electrical, and materials) to translate product requirements into scalable packaging architectures.
• Mitigate high-level reliability risks, such as delamination and solder fatigue, by identifying critical material interactions early in the design cycle.
• Mentor and guide mechanical and packaging engineers in executing detailed simulations and layout optimizations.

Key Qualifications
• B.S., M.S., or Ph.D. (preferred) in Mechanical Engineering, Materials Science, or a related discipline.
• 12+ years of relevant experience in advanced semiconductor packaging architecture, with a focus on thermo-mechanical reliability.
• Expert-level knowledge of 2.5D/3D IC integration, multi-chip modules (MCM), and heterogeneous integration technologies.
• Deep proficiency in ANSYS Mechanical or equivalent tools, specifically regarding nonlinear material modeling and thermal-structural coupling.
• Extensive experience in predicting and managing warpage and strain at both the package and system-module levels.
• Comprehensive understanding of advanced package materials, including underfills, epoxies, molding compounds, and high-density substrates

Preferred Skills
• Proven track record of correlating complex FEA models with long-term reliability data (thermal cycling, drop, and humidity testing).
• Advanced knowledge of electro-thermal or optical-thermal co-simulation for high-performance computing systems.
• Strong strategic vision for heat dissipation design and system-level thermal management.
• Exceptional communication skills, with the ability to influence technical roadmaps across multi-disciplinary global teams.

Why Join Us
At Mixx Technologies, you’ll be part of a fast-moving team rethinking what’s possible in AI infrastructure. We offer a collaborative culture, deep technical challenges, and the opportunity to shape the mechanics behind the world’s most advanced computing systems.